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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays 1/ 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 tsz22111 ? 14 ? 001 www.rohm.com clock generator for a udio /v ideo equipment bu2360fv general description bu2360fv is a clock generator ic capable of generating three types of clocks - video, audio and system clocks that are necessary for dvd player systems. it is a single chip solution that uses pll technology. particularly, the audio clock is a dvd - video reference and yet achieves high c/n characteristics that have low level of distortion factor. features connecting a crystal oscillator generates multiple clock signals from a built - in pll circuit . audio clock of high c/n characteristics providing a low level of distortion factor the audio clock provides switching selection outputs. single power supply of 3.3v applications dvd players key specifications package w (typ) x d(typ) x h(max) typical application circuit (note) we believe that this circuit is to be reco mmended. however, to use it, make further thorough check for the characteristics. part name bu2 36 0fv power so urce voltage [v] 2.7 to 3.6 reference frequency [mhz] 27.0000 output frequency [mhz ] dvd video 1 27.0000 dvd audio, cd (switching outputs ) 512fs 24.5760 22.5792 system 768 (44.1k type) 33.8688 jitter 1 13:clk 32m2 1:vdd2 16: oe 2:vss2 15:clk33m 1 27.0000mhz 3:clk27m 1 14:fsel 4: clk27m 2 5:avdd 12:dvdd 6:avss 11:dvss 7:xtal in 10:clk512fs1 8:xtal out 9:clk512fs2 bu2 360fv 27.0000mhz 0.1f 0.1f open:enable l:disable 33.8688mhz open:48.0khz type l:44.1khz type 33.8688mhz 0.1f 24.5760mhz or 22.5792mhz 24.5760mhz or 22.5792mhz ssop - b16 5.00mm x 6.40mm x 1. 35 mm datashee t datashee t
b u2 360 fv 2 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 pin configuration pin descriptions pin no. pin name pin function 1 vdd2 power supply for 27mhz 2 vss2 gnd for 27mhz 3 clk27m1 27.0000mhz clock output terminal 1 (c l =40pf) 4 clk27m2 27.0000mhz clock output terminal 2 (c l =25pf) 5 avdd power supply for analog block 6 avss gnd for analog block 7 xtalin crystal input terminal 8 xtalout c rystal out put terminal 9 clk512fs2 fsel=open:24.5760mhz, fsel=l:22.5792mhz 10 clk512fs1 fsel=open:24.5760mhz, fsel=l:22.5792mhz 11 dvss gnd for digital block 12 dvdd power supply for digital block 13 clk33m2 33.8688mhz clock output terminal 2 14 fsel pin 9, 10 output selection (with pull - up) open:24.5760mhz( pin 9, 10), l:22.5792mhz( pin 9, 10 ) 15 clk33m1 33.8688mhz clock output terminal 1 16 oe output enable (with pull - up) , open: enable, l:disable ( note) basically, mount ics to the printed circuit board for use. (if the ics are not mounted to the printed circuit board, the characteristics of ics may not be fully demonstrated.) mount 0.1 f capacitors in the v icinity of the ic pins between pin 1 (vdd 2 ) and pin 2 (vss 2 ), pin 5 (av dd ) and pin 6 (av ss ), pin 11 ( d v ss ) and pin 12 ( d v dd ), respectively. depending on the conditions of the printed circuit board, mount an additional electrolytic capacitor between the power supply and gnd terminal. for emi protection, it is effective to put ferrite beads in the origin of power to be supplied to the bu2360fv from the bo ard or to insert a capacitor (of not more than 1 ? 1:vdd2 16:oe 2:vss2 15:clk33m1 3:clk27m1 14:fsel 4:clk27m2 13:clk33m2 5:avdd 12:dvdd 6:avss 11:dvss 7:xtalin 10:clk512fs1 8:xtalout 9:clk512fs2 bu2360fv
b u2 360 fv 3 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 block diagram absolute maximum rati n gs (ta=25 c ) parameter symbol rating unit supply voltage v dd - 0.5 to +7.0 v input voltage v in - 0.5 to v dd +0.5 v storage temperature range tstg - 30 to +125 r c power dissipation p d 0. 45 (note 1 ) w (note 1 ) in the case of exceeding ta = 25 c , 4.5mw to b e reduced per 1 c (note) operating is not guaranteed. (note) power dissipation is measured when the ic is mounted to the printed circuit board. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings . recommended operating condition s parameter symbol limit unit supply voltage v dd 2.7 to 3.6 v input 3 h voltage v ih 0.8v dd to v dd v input 3 l voltage v il 0.0 to 0.2v dd v operating temperature topr - 25 to +85 r c output load c l 15 pf 27m output load 1 cl_27m1 40 (clk27m1) p f 27m output load 2 cl_27m2 25 (clk27m2) pf pll2 1/6 xtal osc xtalin=27.0000mhz pll1 1/6 1/4 7:xtalin 8:xtalout 3:clk27m 1 4:clk27m 2 15:clk33m1 13:clk33m2 10:clk512fs1 9:clk512fs2 16:oe 14:fsel (27.0000mhz) (27.0000mhz) (33.8688mhz) (33.8688mhz) (fsel=open:24.5760mhz fsel=l :22.5792mhz) (fsel=open:48.0khz type fsel=l :44.1khz type) (fsel=open:24.5760mhz fsel=l :22.5792mhz)
b u2 360 fv 4 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 electrical characteristics (v dd =3.3v, ta=25 c , crystal frequency 27.0000mhz, unless otherwise specified.) parameter symbol limit unit conditions min typ max output l voltage v ol - - 0.4 v i ol =4.0m a out put h voltage v oh 2.4 - - v i oh = - 4.0m a fsel input v th l v th l 0.2v dd - - v (note 4 ) fsel input v th h v th h - - 0.8v dd v (note 4 ) hysteresis range v hys 0.2 - - v v hys = v thh v thl (note 4 ) action circuit current i dd - 27.0 40.5 ma at no load clk27m clk27 m - 27.0000 - mhz x tal direct out clk33m clk33m - 33.8688 - mhz x tal x 3136 / 625 / 4 clk512fs clk512_48 - 24.5760 - mhz at fsel=h, xtal x 2048 / 375 / 6 clk512_44 - 22.5792 - mhz at fsel=l, xtal x 3136 / 625 / 6 duty duty 45 50 55 % measured at a vol tage of 1/2 of v dd period - jitter 1 1 p - j 1 1 - 70 - psec (note 1 ) period - jitter min - max p - j min - max - 420 - psec (note 2 ) rise time t r - 2.5 - nsec period of transition time required for the output reach 80% from 20% of v dd . fall time t f - 2.5 - nsec per iod of transition time required for the output reach 20% from 80% of vdd . output lock - time t lock - - 1 msec (note 3 ) ( note) the output frequency is determined by the arithmetic (frequency division) expression of a frequency input to xtalin. if t he input frequency is set to 27.0000 mhz, the output frequency will be as listed above. (note 1 ) period - jitter 1 1 this parameter represents standard deviation ( ? ? v thl v thh v hys 0.2vdd 0.8vdd
b u2 360 fv 5 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves ( b asic data ) fig ure 2. 27mhz period - jitter v dd =3.3v, at c l =40pf 500psec/di v 1.0v/div fig ure 3. 27mhz spectrum v dd =3.3v, at c l =40pf 10khz/div 10db/div rbw=1khz vbw=100hz fig ure 4 . 27mhz output waveform v dd =3.3v, at c l =25pf 5.0nsec/div 1.0v/div fig ure 1. 27mhz output waveform v dd =3.3v, at c l =40pf 5.0nsec/div 1.0v/div
b u2 360 fv 6 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves - continued fig ure 6. 27mhz spectrum v dd =3.3v, at c l =25pf 10khz/div 10db/div rbw=1khz vbw=100hz f ig ure 7 . 33.9mhz output waveform v dd =3.3v, at c l =15pf 5.0nsec/div 1.0v/div fig ure 8 . 33.9mhz period - jitter v dd =3.3v, at c l =15pf 500psec/div 1.0v/div fig ure 5 . 27m hz period - jitter v dd =3.3v, at c l =25pf 500psec/div 1.0v/div
b u2 360 fv 7 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves - continued fig ure 1 0 . 24.6mhz output waveform v dd =3.3v, at c l =15pf 5.0nsec/div 1.0v/div fig ure 1 1 . 24.6mhz period - jitter v dd =3.3v, at c l =15pf 500psec/div 1.0v/div fig ure 1 2 . 24.6mhz spectrum v dd =3.3v, at c l =15pf 10khz/div 10db/div rbw=1khz vbw=100hz fig ure 9 . 33.9mhz spectrum v dd =3.3v, at c l =15pf 10khz/div 10db/div rbw=1khz vbw=100hz
b u2 360 fv 8 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves - continued fig ure 1 5 . 22.6mhz spectrum v dd =3.3v, at c l =15pf 10khz/div 10db/div rbw=1khz vbw=100hz fig ure 1 6. 24.6mhz lt jitter v dd =3.3v, at c l =15pf 1.0nsec/div 1.0v/div lt jitter 2.3nsec fig ure 1 4 . 22.6mhz period - jitter v dd =3.3v, at c l =15pf 500psec/div 1.0v/div fig ure 1 3 . 22.6mhz output wavefor m v dd =3.3v, at c l =15pf 5.0nsec/div 1.0v/div
b u2 360 fv 9 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves - continued fig ure 1 7. 22.6mhz lt jit ter v dd =3.3v, at c l =15pf 1.0nsec/div 1.0v/div lt jitter 2.5nsec
b u2 360 fv 10 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typi cal performance curves - continued ( temperature and supply v oltage variations data ) fig ure 2 0 . period - jitter min - max vs temperature 27mhz (40pf) v dd =3.7v v dd =3.3v v dd =2.4v fig ure 18 . duty vs temperature 27mhz (40pf) v dd =3.7v v dd =3.3v v dd =2.4v temperature : ta [c] duty : duty [%] figure 19 . per iod - -lwwhu1 vs temper ature 27mhz (40pf) v dd =3.7v v dd =3.3v v dd =2.4v temperature : ta [c] period - -lwwhu13- - 1>svhf@ period - jitter min - max : pj - min - ma x [psec] temperature : ta [c] fig ure 2 1 . duty vs temperature 27mhz (25pf) v dd =3.7v v dd =3.3v v dd =2.4v temperature : ta [c] duty : duty [%] 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec]
b u2 360 fv 11 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves - continued figure 2 2 . period - -lwwhu1 vs temperature 27mhz (25pf) v dd =3.7v v dd =3.3v v dd =2.4v fig ure 2 3 . period - jitter min - max vs temperature 27mhz (25pf) temperature : ta [c] fig ure 2 4 . duty vs temperature ( 33.9mhz ) v dd =3.7v v dd =3.3v v dd =2.4v temperature : ta [c] duty : duty [%] figure 2 5 . period - -lwwhu1 vs temperature ( 33.9mhz ) v dd =3.7v v dd =3.3v v dd =2.4v temperature : ta [c] period - -lwwhu13- - 1>svhf@ period - -lwwhu13- - 1>svhf@ v dd =3.7v v dd =3.3v v dd =2.4v temperature : ta [c] period - jitter min - max: pj - min - max [ psec] 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec]
b u2 360 fv 12 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves - continued figure 28 . period - -lwwhu1 vs temperature ( 24.6mhz ) v dd =3.7v v dd =3.3v v dd =2.4v temperature : ta [c] period - -lwwhu13- - 1>svhf@ fig ure 29 . period - jitter min - max vs temperature ( 24.6mhz ) v dd =3.7v v dd =3.3v v dd =2.4v period - jitt er min - max : pj - min - max [psec] temperature : ta [c] fig ure 2 6 . period - jitter min - max vs temperature ( 33.9mhz ) v dd =3.7v v dd =3.3v v dd =2.4v temperature : ta [c] period - jitter min - max : pj - min - max [psec] fig ure 27 . duty vs te mperature ( 24.6mhz ) v dd =3.7v v dd =3.3v v dd =2.4v temperature : ta [c] duty : duty [%] 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature
b u2 360 fv 13 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves - continued figure 3 1 . period - -lwwhu1 vs temperature ( 22.6mhz ) v dd =3.7v v dd =3.3v v dd =2.4v temperature : ta [c] period - -lwwhu13- - 1>svhf@ fig ure 3 0 . duty vs temperature ( 22.6mhz ) v dd =3.7v v dd =3.3v v dd =2.4v temperature : ta [c] duty : duty [%] fig ure 3 2 . period - jitter min - max v s temperature ( 22.6mhz ) v dd =3.7v v dd =3.3v v dd =2.4v temperature : ta [c] period - jitter min - max : pj - min - max [psec] fig ure 3 3 . consumption current vs temperature action circuit current (with m aximum output load ) v dd =3.7v v dd =3.3v v dd =2.4v temperature : ta [c] consumption current : i dd [ma] 0 10 20 30 40 50 -25 0 25 50 75 100 temperature 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature
b u2 360 fv 14 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent n oise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic cap acitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be ro uted separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of t he properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected charact eristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrus h current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capa citor directly to a low - impedance output pin may vxemhfwwkh,&wrvwuhvv$ozd\vglvfkdujhfdsdflwruvfrpsohwho\diwhuhdfksurfhvvruvwhs7kh,&?vsrzhuvxsso\ should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mou nting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplet s (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and ext remely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation o f the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line.
b u2 360 fv 15 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 operational notes C
b u2 360 fv 16 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 ordering information b u 2 3 6 0 f v - e 2 part n umber package fv:ssop - b16 packaging and forming specification e2: embossed tape and reel marking diagram ssop - b16(top view) 2360f part number marking lot number 1pin mark
b u2 360 fv 17 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 physical dimension , tape and reel information package name ssop - b16
b u2 360 fv 18 / 18 tsz02201 - 0e3e0j500670 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 revision history date revision changes 04.nov .2015 001 new release
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperatur e. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bu2360fv package ssop-b16 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bu2360fv - web page distribution inventory

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